HDBSP 2.35% 25 May 2027 (SGD)

Bond Summary

ISIN: SG7CF3000005. Issued by HOUSING &DEVELOPMENT BRD. Currency: SGD. Mid Price: 100.478. Mid Yield: 1.729%. Maturity: 2027-05-25. View full details on WealthLinc.

Data provided by WealthLinc, a wealth management platform for family offices and independent asset managers.

Key Metrics

Key financial data for HDBSP 2.35% 25 May 2027 (SGD)
MetricValue
ISINSG7CF3000005
IssuerHOUSING &DEVELOPMENT BRD
CurrencySGD
Coupon2.35%
Maturity25 May 2027
Mid Price (Clean)100.478
Mid Yield1.729%

Frequently Asked Questions

What is the ISIN of HDBSP 2.35% 25 May 2027 (SGD)?

The ISIN is SG7CF3000005.

What is the current yield?

The mid yield is 1.729%. Data provided by WealthLinc.

What is the current price?

The mid clean price is 100.478 SGD.

Who issued this bond?

This bond was issued by HOUSING &DEVELOPMENT BRD.