QUALCOMM INC 3.25% 20 May 2027 (USD)
Bond Summary
ISIN: US747525AU71. Issued by QUALCOMM INC. Currency: USD. Indicative mid clean price: 99.275. Yield to worst (YTW): 4.678%. Maturity: 2027-05-20. View full details on WealthLinc.
Information displayed by WealthLinc for bond research. Price and YTW figures are indicative where available; no quote observation time is stated.
Key Metrics
| Metric | Value |
|---|---|
| ISIN | US747525AU71 |
| Issuer | QUALCOMM INC |
| Currency | USD |
| Coupon | 3.25% |
| Maturity | 20 May 2027 |
| Indicative mid clean price | 99.275 |
| Yield to worst (YTW) | 4.678% |
Frequently Asked Questions
What is the ISIN of QUALCOMM INC 3.25% 20 May 2027 (USD)?
The ISIN is US747525AU71.
What is the yield to worst?
The indicative YTW shown is 4.678%.
What is the indicative mid clean price?
The indicative mid clean price is 99.275.
Who issued this bond?
This bond was issued by QUALCOMM INC.