MY TECH CITY DEV INV GRP 4.6% 02 Feb 2027 (CNY)
Bond Summary
ISIN: HK0000987765. Issued by MY TECH CITY DEV INV GRP. Currency: CNY. Indicative mid clean price: 100.401. Yield to worst (YTW): 2.728%. Maturity: 2027-02-02. View full details on WealthLinc.
Information displayed by WealthLinc for bond research. Price and YTW figures are indicative where available; no quote observation time is stated.
Key Metrics
| Metric | Value |
|---|---|
| ISIN | HK0000987765 |
| Issuer | MY TECH CITY DEV INV GRP |
| Currency | CNY |
| Coupon | 4.6% |
| Maturity | 02 February 2027 |
| Indicative mid clean price | 100.401 |
| Yield to worst (YTW) | 2.728% |
Frequently Asked Questions
What is the ISIN of MY TECH CITY DEV INV GRP 4.6% 02 Feb 2027 (CNY)?
The ISIN is HK0000987765.
What is the yield to worst?
The indicative YTW shown is 2.728%.
What is the indicative mid clean price?
The indicative mid clean price is 100.401.
Who issued this bond?
This bond was issued by MY TECH CITY DEV INV GRP.