HPS CORPORATE LENDING FU 5.3% 05 Jun 2027 (USD)
Bond Summary
ISIN: USU44276AE02. Issued by HPS CORPORATE LENDING FU. Currency: USD. Indicative mid clean price: 99.791. Yield to worst (YTW): 5.674%. Maturity: 2027-06-05. View full details on WealthLinc.
Information displayed by WealthLinc for bond research. Price and YTW figures are indicative where available; no quote observation time is stated.
Key Metrics
| Metric | Value |
|---|---|
| ISIN | USU44276AE02 |
| Issuer | HPS CORPORATE LENDING FU |
| Currency | USD |
| Coupon | 5.3% |
| Maturity | 05 June 2027 |
| Indicative mid clean price | 99.791 |
| Yield to worst (YTW) | 5.674% |
Frequently Asked Questions
What is the ISIN of HPS CORPORATE LENDING FU 5.3% 05 Jun 2027 (USD)?
The ISIN is USU44276AE02.
What is the yield to worst?
The indicative YTW shown is 5.674%.
What is the indicative mid clean price?
The indicative mid clean price is 99.791.
Who issued this bond?
This bond was issued by HPS CORPORATE LENDING FU.