BIDU 1.9% 15 Mar 2029 (CNY)

Bond Summary

ISIN: HK0001186094. Issued by BAIDU INC. Currency: CNY. Mid Price: 100.26. Mid Yield: 1.795%. Maturity: 2029-03-15. View full details on WealthLinc.

Data provided by WealthLinc, a wealth management platform for family offices and independent asset managers.

Key Metrics

Key financial data for BIDU 1.9% 15 Mar 2029 (CNY)
MetricValue
ISINHK0001186094
IssuerBAIDU INC
CurrencyCNY
Coupon1.9%
Maturity15 March 2029
Mid Price (Clean)100.26
Mid Yield1.795%

Frequently Asked Questions

What is the ISIN of BIDU 1.9% 15 Mar 2029 (CNY)?

The ISIN is HK0001186094.

What is the current yield?

The mid yield is 1.795%. Data provided by WealthLinc.

What is the current price?

The mid clean price is 100.26 CNY.

Who issued this bond?

This bond was issued by BAIDU INC.