HDBSP 2.21% 14 Jul 2033 (SGD)

Bond Summary

ISIN: SGXF23777000. Issued by Housing and Development Board. Currency: SGD. Mid Price: 99.546. Mid Yield: 2.281%. Maturity: 2033-07-14. View full details on WealthLinc.

Data provided by WealthLinc, a wealth management platform for family offices and independent asset managers.

Key Metrics

Key financial data for HDBSP 2.21% 14 Jul 2033 (SGD)
MetricValue
ISINSGXF23777000
IssuerHousing and Development Board
CurrencySGD
Coupon2.21%
Maturity14 July 2033
Mid Price (Clean)99.546
Mid Yield2.281%

Frequently Asked Questions

What is the ISIN of HDBSP 2.21% 14 Jul 2033 (SGD)?

The ISIN is SGXF23777000.

What is the current yield?

The mid yield is 2.281%. Data provided by WealthLinc.

What is the current price?

The mid clean price is 99.546 SGD.

Who issued this bond?

This bond was issued by Housing and Development Board.