MY TECH CITY DEV INV GRP 1.99% 09 Nov 2031 (CNY)

Bond Summary

ISIN: HK0001366886. Issued by MY TECH CITY DEV INV GRP. Currency: CNY. Maturity: 2031-11-09. View full details on WealthLinc.

Information displayed by WealthLinc for bond research. Price and YTW figures are indicative where available; no quote observation time is stated.

Key Metrics

Key financial data for MY TECH CITY DEV INV GRP 1.99% 09 Nov 2031 (CNY)
MetricValue
ISINHK0001366886
IssuerMY TECH CITY DEV INV GRP
CurrencyCNY
Coupon1.99%
Maturity09 November 2031

Frequently Asked Questions

What is the ISIN of MY TECH CITY DEV INV GRP 1.99% 09 Nov 2031 (CNY)?

The ISIN is HK0001366886.

Who issued this bond?

This bond was issued by MY TECH CITY DEV INV GRP.